Microwave plasma cleaning technology has many advantages, such as no-damage, high efficiency, and no electrode sputter pollution. It can thoroughly clean and treat contaminants on the surface of materials, and is especially suitable for packaging cleaning of sensitive chips.

The Multi-Chamber cluster coating system is a cluster of vacuum chamber systems interconnected through the transfer chamber which placed in center of cluster system.

The annealing furnace is a process method used in the fabrication of semiconductors. This process includes heating a plurality of semiconductor wafers to affect their electrical properties.

In order to cope with fast experiments and limited space, SYSKEY has developed extremely small equipment for 2-inch glass and wafer substrates, we called “Mini Line”.

Products for safe storage and handling of reticles,as well as mask aligners and uv meters.