Syskey Technology Co., Ltd.

Products

FPD-PECVD

OLEDs / Display

OPV / Perovskite Solar-Cell

Semiconductors

Physical / Material research

With the increase in size of LCD panels and glass need of manufacturing, manufacturing equipment has also become larger, requiring ever-larger equipment investments.SYSKEY systems offer processes for amorphous silicon (a-Si), silicon oxide (SiO_x), silicon nitride (SiN_x), silicon oxynitride (SiON) and multi-layer depositions.

Applications
Amorphous Silicon (a-Si). Silicon Nitride (SiN_x). Silicon Oxide, Silane based (SiO_x). Silicon Oxide, TEOS based (SiO_x).
Configurations and benefits	Options
Flexible substrate size up to 550 x 650 mm² (glass). Excellent thin-film uniformity of less than ±3%. Up to six 7 gas lines per process chamber standard. In-situ chamber clean using remote plasma source. Substrate heating up to 380°C with stable temperature control.	Cassette port. Patented TEOS vaporizing system (TVS) for TEOS deposition. Extra spare port for OES, RGA or extra process monitoring.