Lift-Off is a process of creating pattern on the substrate surface and opposite to etching process. In this process, E-beam evaporation is used to deposit desired layer (metal) in substrate surface. For SYSKEY's system can control the evaporation rate, the film thickness and uniformity is less than +/- 3%. 

 Design stage water cooling or liquid nitrogen cooling for Lift-Off process.

Lift-off process steps:


1. Preparation of the substrate.
2. Deposition of the sacrificial stencil layer.
3. Patterning the sacrificial layer (ex. etching), creating an inverse pattern.
4. Deposition of the target material.
5. Washing out the sacrificial layer together with the target material on its surface.
6. Final pattern layers:
②Sacrificial layer
③Target material







Applications Chamber
  • LIFT-OFF process.


  • Flexible chamber sizes depend on substrate size and applications.
  • Chamber height ≧650 mm.
  • Ultimate vacuum of chamber about 10-8 Torr.
Configurations and benefits Options
  • Flexible substrate size up to 12 inch wafer in diameter.
  • Excellent thin-film uniformity of less than ±3%.
  • Multi-pocket rotary e-beam sources (1/2/4/6 crucibles) with water cooled crucible.
  • Auto deposition rate control.
  • Multiple sources with sequential operation or co-deposition.
  • Substrate holder-cooling (liquid nitrogen down to -70°C).
  • Intergrated with Load-Lock, robot arm, glove box.





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