+886-3-5590169
+886-3-5574282
info@syskey.com.tw
MENU

Products

Co-Sputter

OLEDs / Display

OPV / Perovskite Solar-Cell

Semiconductors

Physical / Material research

Co-sputtering is simultaneous coating from two or multiple sputtering targets. It is used for compound - alloy or composite material. The thin film is controlled by optimizing the power density of each gun (target). SYSKEY's magnetron co-sputtering system provides precise control of multiple magnetron sputtering process conditions to provide customers with the best quality composite film.

 

 

SYSKEY's sputter system has a single loading and cassette loading chamber, which can save the pumping time of the process.

 

 

SYSKEY's sputter system can independently apply bias voltage on its stage part to clean and  increasethe adhesion of materials.

 

 

 

Ion source can be used to clean the  substrate and accelerate the sputtering speed of the coating material, and the ion beam helps deposit and compact the deposited films during the material deposition process.

 

Applications Chamber
  • Semiconductors​.
  • Nanotechnology.
  • Product QC & QA.
  • Oxide, Nitride and Metal.
  • Materials research.
  • Solar-cell.
  • Optical Research.
  • Materials Research.
  • Flexible chamber sizes depend on substrate size and applications.
  • Full-width opening door integrated two viewports with shutters for observing substrate and sputter sources.
  • Full range vacuum gauge with display and Baratron gauge for closed-loop pressure control.
  • Ultimate vacuum of chamber about 10-8 Torr.
 
 
Configurations and benefits Options
  • Flexible substrate size up to 12 inch.
  • Excellent thin-film uniformity of less than ±3%.
  • Magnetron sputtering sources (up to 8 sources) with optional target sizes.
  • Multiple sources with sequential operation or co-deposition.
  • RF, DC or pulsed-DC for non-conductive or conductive target.
  • Deposition of multilayer films with selected target materials.
  • Mass flow controllers (up to 4 gas lines).
  • Substrate holder heating up to 1000°C.
  • Adjustable substrate to target spacing.
  • Shutters are installed each sputtering source and substrate.
  • Intergrated with Load-Lock, robot arm, glove box.
  • Combined with Ion-source, thermal source, E-beam, etc.
  • Substrate RF or DC bias.
  • Thickness monitor.
  • Substrate RF plasma cleaning.
  • Extra spare port for OES, RGA or extra    
    process monitoring.
 
 
 
 

 

application field

Related Products

Magnetron Sputter

Sputtering deposition is a PVD method in which a thin film is formed by sputtering a material from a target and then depositing it on a substrate.

UHV Sputter

For UHV environment, it is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process.

Multi-Layer Sputter

The high-quality multilayer films are becoming increasingly important in precision systems that single material thin film cannot practice the required specifications.

In-Line Sputter

In-Line Sputtering Deposition System is that substrates passed linearly beneath one or more sputter cathodes to acquire their thin film coating.

FPD-PVD

It has 4 independent sputtering chambers, allowing customers to arbitrarily match the deposited materials, while maintaining a quick and low-cost system.

We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it.(Privacy policy)

Refause