E-beam is generated from a tungsten filament and driven by electric and magnetic fields toward source material and transforms it into the gaseous phase to be deposited on the substrate surface.

E-beam deposition system is a method of using electron beam generated from an electron source in a vacuum to material, and heating and evaporating it so that the evaporated material forms a thin film on the substance.

For UHV environment, it is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process.

Lift-Off is a process of creating pattern on the substrate surface and opposite to etching process.

Chemical Vapor Deposition is a chemical technology prepared from high-purity, high-performance solid materials.

PECVD alternate for depositing a variety of thin films at lower temperatures than conventional CVD methods without losing film quality.

It can provide some energy for the deposition reaction. Compared with the PECVD, ICP-CVD can deposit various films at a lower temperature without degrading the film quality.

This reaction at the surface is what forms the solid phase material. Low pressure is used to reduce of gas phase reactions, and also increases the uniformity across the substrate.

With the increase in size of LCD panels and glass need of manufacturing, manufacturing equipment has also become larger, requiring ever-larger equipment investments.