Syskey Technology Co., Ltd.

Applications

OLEDs / Display

OLEDs panels are made of organic materials and emit light when they are energized through organic materials. Since OLEDs do not require a backlight and filters (just like LCD displays), they can turn on-off each individual pixel. When it's on, it emits visible light and when it's off, it emits no light. Thus, it can display deep black color and higher the contrast ratio.

The main component of an OLEDs display is the OLEDs emitter an organic material that emits light when power is applied. The basic structure of an OLEDs is an emission layer sandwiched between a cathode (injecting electrons) and an anode (injecting holes). To improve performance OLEDs, electron transport layer (ETL), blocking layer (BL), hole transport layer (HTL), hole injection layer (HIL) are inserted in OLEDs structure to enhence the transportation, density and combination of exciton, show in Figure1.

When an external bias is added to make the electrons, holes pass through the hole transport layer and the electron transport layer and enter an organic substance with light-emitting properties. When recombination occurs within them, light emission is formed. The color of OLEDs depend on the chemical structure of light-emitting material (band gaps of light-emitting materials), therefore the color of OLEDs can be controlled by material selection.

Based on properties of organic material, OLEDs displays not only are thin and effective, but they can also be made transparent, flexible, rollable and foldable displays in the future. OLEDs provide the best image quality ever, so it accelerates the development of VR and AR to market faster.

　　　　　　　　　Figure 1: Basic structure of a OLEDs

Technology

The mainstream production technology of OLEDs is evaporation technology. The core technology for manufacturing OLEDs panels is the evaporation technology through evaporation systems. The evaporation is a common method of thin-film deposition using current heating in vaccum (like thermal resistance evaporation source) to evaporate the material that is evaporated into atoms or molecules. They then move in a straight line with a mean free path and collide with the substrate surface to deposit a thin film.

Magnetron Sputter

Sputtering deposition is a PVD method in which a thin film is formed by sputtering a material from a target and then depositing it on a substrate.

Co-Sputter

Co-sputtering is simultaneous coating from two or multiple sputtering targets. It is used for compound - alloy or composite material.

UHV Sputter

For UHV environment, it is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process.

Multi-Layer Sputter

The high-quality multilayer films are becoming increasingly important in precision systems that single material thin film cannot practice the required specifications.

In-Line Sputter

In-Line Sputtering Deposition System is that substrates passed linearly beneath one or more sputter cathodes to acquire their thin film coating.

FPD-PVD

It has 4 independent sputtering chambers, allowing customers to arbitrarily match the deposited materials, while maintaining a quick and low-cost system.

Thermal Evaporation

The materials are placed in a resistive heat source in vacuum environment to evaporate directly to the substrate, where they condense back to a solid state form a thin film.

Metal Thermal

The evaporation source using electric heating can be used to deposit most organic and inorganic thin films, among which the resistance Joule method is the most common.

Organic Material

This process requires high precision and uniformity of thin films by accurately controlling temperature and deposition rate.

Electron Beam Evaporation

E-beam is generated from a tungsten filament and driven by electric and magnetic fields toward source material and transforms it into the gaseous phase to be deposited on the substrate surface.

E-Beam Evaporation System

E-beam deposition system is a method of using electron beam generated from an electron source in a vacuum to material, and heating and evaporating it so that the evaporated material forms a thin film on the substance.

UHV E-Beam

For UHV environment, it is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process.

Lift-Off

Lift-Off is a process of creating pattern on the substrate surface and opposite to etching process.

CVD

Chemical Vapor Deposition is a chemical technology prepared from high-purity, high-performance solid materials.

PECVD

PECVD alternate for depositing a variety of thin films at lower temperatures than conventional CVD methods without losing film quality.

LPCVD

It can provide some energy for the deposition reaction. Compared with the PECVD, ICP-CVD can deposit various films at a lower temperature without degrading the film quality.

ICP-CVD

This reaction at the surface is what forms the solid phase material. Low pressure is used to reduce of gas phase reactions, and also increases the uniformity across the substrate.

FPD-PECVD

With the increase in size of LCD panels and glass need of manufacturing, manufacturing equipment has also become larger, requiring ever-larger equipment investments.

Diamond Like Carbon (DLC)

Diamond-like Carbons are formed from combining high concentrate sp3 bonding (Diamond) with low concentrate sp2 bonding.

Batch Type PECVD

The batch type Plasma Enhanced Chemical Vapor Deposition (PECVD) can provide energy for deposition reaction.

ALD

It can be considered as a special type of chemical vapor deposition. The majority of ALD reactions use two or more chemicals called precursors.

Thermal ALD

In most ALD reactions, two chemicals are used as precursors. These precursors react with the material surface in a continuous and self-limiting manner.

Plasma ALD

This process allows fabricating the conformal thin films of various materials with atomic-scale control without high temperature required to deliver the necessary activation energy.

Plasma Etching

Dry etching is known as plasma dry etching is the process of removing materials from the surface of another material.

RIE

The RIE process is a chemical physical etching process, and is the most important process for constructing various films in semiconductor manufacturing.

ICP-RIE

The high density plasma is created, surrounded by the coil, and act as the secondary coil in a transformer, accelerating the electrons and ions, and thus causing collisions that produce even more ions and electrons.

ALE

As the functional size of the device is further reduced, further use of ALE is required to achieve its required accuracy.

Microwave Plasma Systems

Microwave plasma cleaning technology has many advantages, such as no-damage, high efficiency, and no electrode sputter pollution. It can thoroughly clean and treat contaminants on the surface of materials, and is especially suitable for packaging cleaning of sensitive chips.