Syskey Technology Co., Ltd.

Products

Batch Type PECVD

OLEDs / Display

OPV / Perovskite Solar-Cell

Semiconductors

Physical / Material research

The batch type Plasma Enhanced Chemical Vapor Deposition (PECVD) can provide energy for deposition reaction. Compare to traditional CVD method, it can deposit various films at lower temperature without reducing the quality of it.This system is specifically designed for parylene. The substrate of which can both rotate and orbit, and can batch produce. Parylene film has the properties of high uniformity, high filling, high penetrability, etc. And can be applied on electro-optical package, PCB insolation.

Applications	Chamber
Wear coatings for medical & commercial products. Encapsulation, isolation. Scratch-resistant displays.	Flexible chamber sizes depend on substrate size and applications. Chamber temperature control by using heater jacket, Cooling water, Hot water.
Configurations and benefits	Options
Flexible substrate size. Multi wafers Process. Excellent thin-film uniformity of less than ±3%. Mass flow controllers with highly uniform gas distribution. Direct and remote capacitive coupled plasma (CCP).

LPCVD

It can provide some energy for the deposition reaction. Compared with the PECVD, ICP-CVD can deposit various films at a lower temperature without degrading the film quality.

ICP-CVD

This reaction at the surface is what forms the solid phase material. Low pressure is used to reduce of gas phase reactions, and also increases the uniformity across the substrate.

FPD-PECVD

With the increase in size of LCD panels and glass need of manufacturing, manufacturing equipment has also become larger, requiring ever-larger equipment investments.

CVD

Chemical Vapor Deposition is a chemical technology prepared from high-purity, high-performance solid materials.

PECVD

PECVD alternate for depositing a variety of thin films at lower temperatures than conventional CVD methods without losing film quality.

LPCVD

It can provide some energy for the deposition reaction. Compared with the PECVD, ICP-CVD can deposit various films at a lower temperature without degrading the film quality.

ICP-CVD

This reaction at the surface is what forms the solid phase material. Low pressure is used to reduce of gas phase reactions, and also increases the uniformity across the substrate.

FPD-PECVD

With the increase in size of LCD panels and glass need of manufacturing, manufacturing equipment has also become larger, requiring ever-larger equipment investments.

LPCVD

It can provide some energy for the deposition reaction. Compared with the PECVD, ICP-CVD can deposit various films at a lower temperature without degrading the film quality.

ICP-CVD

This reaction at the surface is what forms the solid phase material. Low pressure is used to reduce of gas phase reactions, and also increases the uniformity across the substrate.

FPD-PECVD

With the increase in size of LCD panels and glass need of manufacturing, manufacturing equipment has also become larger, requiring ever-larger equipment investments.