Batch Type PECVD


The batch type Plasma Enhanced Chemical Vapor Deposition (PECVD) can provide energy for deposition reaction. Compare to traditional CVD method, it can deposit various films at lower temperature without reducing the quality of it.This system is specifically designed for parylene. The substrate of which can both rotate and orbit,  and can batch produce. Parylene film has the properties of high uniformity, high filling, high penetrability, etc. And can be applied on electro-optical package, PCB insolation.


Applications Chamber
  • Wear coatings for medical & commercial products.
  • Encapsulation, isolation.
  • Scratch-resistant displays.
  • Flexible chamber sizes depend on substrate size and applications.
  • Chamber temperature control by using heater jacket, Cooling water, Hot water.


Configurations and benefits Options
  • Flexible substrate size.
  • Multi wafers Process.
  • Excellent thin-film uniformity of less than ±3%.
  • Mass flow controllers with highly uniform gas distribution.
  • Direct and remote capacitive coupled plasma (CCP).



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