Dry etching is known as plasma dry etching is the process of removing materials from the surface of another material.
Atomic layer etching (ALE) is an advanced etching technique that can precisely control its etching depth. As the functional size of the device is further reduced, further use of ALE is required to achieve its required accuracy.
This has drawn attention to a technique called atomic layer etching (ALE), which overcomes the limitations of conventional (continuous) etching at the atomic level. Plasma-based atomic layer etching is a periodic etching process by gas implantation and ion bombardment, and has the potential to remove a single thin film with very little damage.
For SYSKEY's system can control the gas and plasma process, can perfectly produce high- precision thin films etching.
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