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Products

In-Line Sputter

 

 

In-Line sputtering deposition system is that substrates passed linearly beneath one or more sputter cathodes to acquire their thin film coating. And it can just be chains running along rails through the vacuum chamber.
 

For the power can be any of the various types available, such as RF, DC, or pulsed DC asdesired for the application. Optional stages such as sputter etch, heat, or ion sources can also be accommodated, and the full array of instrumentations and controls are available formetallic/conductive coatings, dielectrics, optical coatings or other sputter applications.
 

 

 

For SYSKEY's in-line sputter deposition system, it provides precise control of in-line sputtering process conditions to provide customers with the best quality thin film.

 

 





                                                                                                                                                                 
 


 

Applications Chamber
  • Nanotechnology.
  • Product QC & QA.
  • Materials research.
  • Solar-cell.
  • Touch panel.
  • TFT-LCD.
  • Oxide, nitride and metal materials research.
  • Flexible chamber sizes depend on substrate size and applications.
  • Full range vacuum gauge with display and Baratron gauge for closed-loop pressure control.
  • Ultimate vacuum of chamber about 10-7Torr.

 

Configurations and benefits Options
  • Flexible substrate size up to 1100 x 1300 mm2 (glass).
  • Excellent thin-film uniformity of less than ±5%.
  • High Deposition Rate ≥ 250 nm/min and high efficiency cathode.
  • Sputter power: RF 5kW, DC or pulsed-DC max 20kW.
  • Mass flow controllers with highly uniform gas distribution.
  • Substrate heating up to 400°C with stable temperature control.
  • Vertical or horizontal sputtering.

 

  • Carrier return system.
  • Robot for auto loading.
  • Extra spare port for OES, RGA or extra process monitoring.
  • ntergrated with Load-Lock, robot arm, glove box.
  • Combined with Ion-source, thermal source, E-beam, etc.
  • RF or DC bias switching.
  • Thickness monitor.
  • Substrate RF plasma cleaning.
  • Extra spare port for OES, RGA or extra process monitoring.