An UHV environment is characterized by pressures lower than 10^-8 ~10^-12 Torr and it is common in chemistry, physics, and engineering. For UHV environment, it is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process and use of low energy electron and ion-based experimental techniques without undue interference from gas phase scattering. In the Ultra-High Vacuum sputter system, SYSKEY can perfectly produce high-quality thin films.

 

 

 

 

 

 

Design the substrate rotary coating mechanism for ultra-high vacuum and high temperature heating. Using ceramic Palin rotation, and do a water cooling cycle inside to protect the  mechanism to makes sure the stability of long-term operation.
 

 

Applications	Chamber
Semiconductors. Nanotechnology. Product QC & QA. Oxide, Nitride and Metal materials research. Solar-cell. Optical Research. Materials Research.	Chamber metal sealing and heater backing to 150°C. Flexible chamber sizes depend on substrate size and applications. Full range vacuum gauge with display and Baratron gauge for closed-loop pressure control. Ultimate vacuum of chamber about 10-10 Torr.
Configurations and benefits	Options
Flexible substrate size up to 12 inch. Excellent thin-film uniformity of less than ±3%. Magnetron sputtering sources (up to 8 sources) with optional target sizes. RF, DC or pulsed-DC for non-conductive or conductive target. Deposition of multi-layer films with selected target materials. Mass flow controllers (up to 4 gas lines). Substrate holder heating up to 1000°C. Adjustable substrate to target spacing. Shutters are installed each sputtering source and substrate.	Intergrated with others vacuum system. Combined with Ion-source, thermal source, E-beam, etc. RF or DC bias switching. Thickness Monitor. Substrate RF plasma cleaning. Extra spare port for OES, RGA or extra process monitoring.